Adjustable 0.5–3.0w Laser System Integration
Overview
Role & Ownership
Designed an adjustable 0.5–3.0W laser subsystem in close partnership with an EE, owning the mechanical system integration from packaging through validation builds. The assembly included three PCBAs, serviceable flex cable routing, Diode, Heatsink, Fan, and a front panel with soft press buttons. A key risk was thermal stability, so I developed 3D-printed cooling duct concepts guided by analysis and refined using measured temperature/airflow data. The result was a robust electro-mechanical architecture with validated thermal behavior and a clear path to repeatable assembly and manufacturing.
• Mechanical Design owner for system packaging, interfaces, and integration with EE-owned electronics
• Defined mechanical stack-up, routing constraints, access/service strategy, and assembly sequencing
• Designed enclosure + UI mechanics (front panel, soft press button interfaces, retention features)
• Developed and iterated cooling duct concepts; tested and fed measured data back into design refinements
• Produced manufacturable CAD/drawings and prototype builds supporting design convergence
Approach
1. Requirements + CTQs: power adjustability, thermal limits, safety/packaging constraints, serviceability
2. Architecture tradeoffs: mechanical layout to support electronics segmentation (3 PCBAs) + routing paths
3. CAD + tolerance strategy: defined datums/interfaces for PCBA location and flex strain relief; controlled stack-up
4. Prototype iterations: fit checks and UI feel validation; enclosure/duct revisions
5. Characterization / validation: measured temps + airflow; compared to modeled assumptions; iterated geometry
6. DFM + release readiness: simplified routing/assembly steps; locked interfaces for repeatable builds
Principle EE preparing PCBAs for assembly
Principle EE preparing PCBAs for assembly
results
• Delivered a fully integrated adjustable laser system architecture (0.5–3.0W) with stable packaging and routing
• Reduced thermal risk through a closed-loop “analyze → build → measure → refine” design approach
• Produced build-ready documentation and a manufacturable assembly intent for repeatable prototypes and future vendor sourcing